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Home > Quality > Quality App. Notes, Related Standards and PCNs

Quality App. Notes, Related Standards and PCNs

Document Title / Description Doc. # Date
AN-135: HI-8596 Single +3.3V Line Driver EMI Qualification to RTCA/DO-160G Section 21 Rev. New 5/18/2011
The HI-8596 is a line driver designed in accordance with the ARINC 429 bus specification. The part includes a dual polarity voltage doubler, allowing it to operate from a single +3.3V supply using only four external capacitors. The DO-160G compliance test was performed to evaluate the electromagnetic interference of the HI-8596 in its anticipated operating environment in aeronautical operations.
Download AN-135
AN-136: HI-8592 Single +5V Line Driver EMI Qualification to RTCA/DO-160G Section 21 Rev. New 5/18/2011
The HI-8592 is a line driver designed in accordance with the ARINC 429 bus specification. The part includes a voltage doubler, allowing it to operate from a single +5V supply using only two (2) external capacitors. The DO-160G compliance test was performed to evaluate the electromagnetic interference of the HI-8592 in its anticipated operating environment in aeronautical operations. The HI-8592 wa
Download AN-136
AN-400: Surface Mount Plastic Packages for High Reliability Applications Rev. I 4/1/2008
The AN-400 Application Note provides potential users of plastic encapsulated ICs with an overview of the available technology, guidelines for their use, and a summary of Holt’s rigorous qualification and screening procedures.
Download AN-400
Lead-free / RoHS policy Rev 1.0 3/30/2007
In compliance with the RoHS European directives to eliminate lead in the electronics industry, Holt Integrated Circuits has adopted the use of 100% matte tin (Sn) plating for its RoHS compliant plastic packages.
Download RoHS policy
AN-300: ARINC 429 Lightning Protection, RTCA/DO-160G, Section 22 Level 3 Rev. F 7/15/2011
The Holt AN-300 Application Note provides a general overview of the effects of lightning on avionics systems in an aircraft along with the recommended protection measures. Included are lightning protection guidelines for Holt’s ARINC 429 line driver and receiver products.
AN-301: ARINC 429 Lightning Protection, RTCA/DO-160G, Section 22 Level 4 Rev. B 1/27/2012
This Application Note provides recommended practices for protection against lightning induced transient susceptibility for Holt’s latest generation of ARINC 429 line drivers and receivers.
CAN Conformance Test Report Rev. 0.0 1/16/2012
The CAN Conformance Test Report describes the independent validation of Holt's CAN controller family according to ISO 11898 by C&S group, GmbH. The validation was performed to test specification ISO16845.
AN-302: ARINC 825 CAN Lightning Protection to RTCA/DO-160G, Section 22 Level 4 Rev. New 1/21/2012
This Application Note provides recommended practices for protection against lightning induced transient susceptibility for Holt’s family of ARINC 825 CAN transceivers. This recommended circuit diagram was tested according to RTCA/DO-160G, Section 22 Level 4 Pin Injection Test Waveform Set A (3 & 4), Set B (3 & 5A), Set Z (3 & 5B).
Document Title / Description Doc. # Date
High Temperature Storage Life JESD22-A103 --
JEDEC test method used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices.

Temperature Cycling JESD22-A104 --
JEDEC test method for determining the capability of solid state devices to withstand extreme temperature cycling.

Temperature, Bias, and Operating Life JESD22-A108 --
JEDEC test method for determining the effects of bias conditions and temperature, over time, on solid state devices.

Highly-Accelerated Temperature and Humidity Stress Test (HAST) JESD22-A110 --
JEDEC test method to evaluate the reliability of nonhermetic packaged solid state devices in humid environments.

Preconditioning of Plastic Surface Mount Devices Prior to Reliability Testing JESD22-A113 --
Industry standard preconditioning flow for plastic SMDs (surface mount devices) that is representative of a typical industry multiple solder reflow operation.

Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM) JESD22-A114 --
This test method establishes a standard procedure for testing and classifying microcircuits according to their susceptibility to damage or degradation by exposure to a defined electrostatic Human Body Model (HBM) discharge (ESD). The objective is to provide reliable, repeatable HBM ESD test results so that accurate classifications can be performed.

Requirements for Handling Electrstatic-Discharge-Sensitive(ESDS) Devices JESD625-A --
JEDEC standard that establishes the minimum requirements for Electrostatic Discharge (ESD) control methods and materials used to protect electronic devices that are susceptible to damage or degradation from electrostatic discharge (ESD).

Moisture / Reflow Sensitivity Classification for Nonhermetic Solid State Surface J-STD-020 --
JEDEC standard for identifying the classification level of non-hermetic solid state Surface Mount Devices (SMDs) that are sensitive to moisture-induced stress.

Standard for Handling, Packing, Shipping and Use of Moisture / Reflow Sensitive J-STD-033 --
JEDEC standard that specifies the standardized levels of floor life exposure for moisture/reflow sensitive SMDs along with the handling, packing and shipping requirements necessary to avoid moisture/reflow-related failures.

Document Title / Description Doc. # Date
CMOS Display Driver Products Datasheet Change v.1.0 12/7/2007
Holt Integrated Circuits is making a change in Datasheet IDD parameter to account for typical manufacturing variability in it's CMOS High Voltage LCD Display Driver Products.
Download PCN0703
ARINC 429 Line Driver Die Change for HI-8585 & HI-8586 Products v.1.0 12/3/2007
The purpose of this notification is to document die change to the HI-8585 and HI-8586 ARINC 429 Line Driver products.
Download PCN0704
44-Pin Plastic QFP Assembly Location Change v.1.0 3/6/2008
The purpose of this notice is to describe the changes to the 44-pin plastic QFP packages for the HI-8448PQxx-xx family of ARINC 429 line receiver products.
Download PCN0707
HI-6110 Die Revision and Data Sheet Change v.1.0 5/14/2008
The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-6110 Product which will result in a change to its data sheet.
Download PCN0801
Marking and Data Sheet Change for HI-3585 Series of ARINC 429 SPI Interface Products v.1.0 5/14/2008
The purpose of this notification is to announce that Holt Integrated Circuits has standardized the naming and top side marking convention for the 3585 series of ARINC 429 SPI interface products and released the final production version of their respective data sheets.
Download PCN0802
44L TQFP (PTQS) Package Lead Formation v.1.0 5/28/2008
The purpose of this notification is to announce a change to the 44L TQFP (PTQS) package lead formation.
Download PCN0803
44L PLCC Package and DAP Size Standardization v.1.0 6/30/2008
The purpose of this notification is to announce that Holt Integrated Circuits has standardized the Die Attach Pad (DAP) size configuration for all products which previously used the 300 mil x 300 mil DAP 44L PLCC Package.
Download PCN0804
52-Lead Quad Flat Pack (QFP) Package Transfer v.1.0 9/12/2008
The purpose of this notice is to describe the changes to the 52-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.
Download PCN0805
Assembly Location and Mold Compound Change for QFN Packages v.1.0 9/12/2008
The purpose of this notice is to describe the changes to the QFN packages for the ARINC 429 and MIL-STD 1553 family of devices.
Download PCN0806
HI-6110 Die Revision and Data Sheet Change v.1.0 12/12/2008
The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-6110 Product which will result in a change to its data sheet.
Download PCN0807
3182PSx-N ARINC 429 Differential Line Driver Change for v.1.0 11/12/2008
The purpose of this notice is to describe the changes to the ARINC 429 Differential Line Driver Die Change for the 3182PSx-N.
Download PCN0808
32 & 64-Lead Quad Flat Pack (QFP) Package Transfer v.1.0 9/12/2008
The purpose of this notice is to describe the changes to the 32-Lead & 64-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, Discrete to Digital and LCD Display Driver family of devices.
Download PCN0809
Addition of Criteria Labs in Austin, Texas as a qualified ceramic package assembly supplier. v.1.0 12/2/2008
The purpose of this notice is to announce the addition of Criteria Labs in Austin, Texas as a qualified assembly supplier for ceramic side-brazed DIP package for both ARINC 429 and MIL-STD 1553 family of devices.
Download PCN0810
Wafer Fab Process Transfer for HI-8382/8383 & HI-8588/8588-10 Series of ARINC 429 Products v.1.0 12/2/2008
The purpose of this notice is to announce the completed transfer of the Holt devices manufactured using the 100mm 4.0um CMOS Wafer Process at Dalsa Semiconductor in Quebec, Canada to Dalsa’s 150mm 4.0um CMOS Wafer Process within the same fab.
Download PCN0811
Die Change for HI-3186PSx ARINC 429 Differential Line Driver v.1.0 12/2/2008
This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the HI-3186PSx.
Download PCN0812
Die Change for HI-3182PJx & HI-3183PJx ARINC 429 Differential Line Drivers v.1.0 7/28/2009
This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the HI-3182PJx and HI-3183PJx.
Download PCN0901
Die Change for HI-3188PSx ARINC 429 Differential Line Driver v.1.0 7/28/2009
This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the HI-3188PSx.
Download PCN0902
Die Change for HI-3182PSx & HI-3183PSx ARINC 429 Differential Line Drivers v.1.0 7/28/2009
This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the HI-3182PSx & HI-3183PSx.
Download PCN0903
HI-3585 & HI-3588 Data Sheet Change v.1.0 5/7/2010
The purpose of this notification is to announce that Holt Integrated Circuits has made a Datasheet change to the HI-3585 & HI-3588 Product which will result in the elimination of Product Advisory PA-100.
Download PCN1001
HI-3185PSx & HI-3185PSx-N ARINC 429 Line Driver Die Change v.1.0 4/22/2010
This notice describes the changes to the ARINC 429 Differential Line Driver Die for the HI-3185PSx & HI-3185PSx-N.
Download PCN1002
100-Lead Quad Flat Pack (QFP) Package Transfer v.1.0 4/22/2010
100-Lead Quad Flat Pack (QFP) Package Transfer
Download PCN1003
HI-3582A, HI-3583A & HI-3584A Data Sheet Change v.2.0 7/19/2010
The purpose of this notification is to announce that Holt Integrated Circuits has made a Datasheet change to the HI-3582A, HI-3583A, & HI-3584A Product.
Download PCN1004
MIL-STD-1553 Bus Transceivers Plastic SOIC Package Change v.1.0 6/22/2010
The purpose of this notification is to announce that Holt Integrated Circuits has made a change to the lead standoff for the 20 Pin Plastic Small Outline ESOIC-WB packages assembled at CEI, Thailand.
Download PCN1005
52 & 44 Lead Quad Flat Pack (QFP) MSL Improvement v.1.0 10/1/2010
The purpose of this notification is to announce that Holt Integrated Circuits has made a change to the 52 & 44 Lead Quad Flat Pack (QFP) packages to improve the moisture sensitivity level (MSL) for the ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.
Download PCN1006
28 Plastic Leaded Chip Carrier (PLCC) Lead Frame, Mold Compound & Die Attach Change v.1.0 10/1/2010
The purpose of this notification is to announce that Holt Integrated Circuits has made a change to the 28 J-Lead PLCC Package for the ARINC 429 family of devices.
Download PCN1007
Addition of Greatek Electronic, Taiwan for QFN, TQFP, TSSOP & SOIC Package Assembly v.1.0 12/1/2011
The purpose of this notification is to announce the addition of Greatek Electronic, Taiwan assembly facility for QFN, TQFP, TSSOP and Small Outline (SOIC) packages for Holt’s ARINC 429, ARINC 825, MIL-STD 1553, Discrete to Digital, & LCD Display Driver family of devices.
Download PCN1101
44-Lead Quad Flat Pack (QFP) Footprint & Package Change v.1.0 12/1/2011
This notice describes the footprint and package changes to the 44 Lead Quad Flat Pack (QFP) Package for all of Holt’s ARINC family of devices.
Download PCN1102
52-Lead Quad Flat Pack (QFP) Package Change & Transfer v.1.0 12/1/2011
This notice describes the package changes to the 52 Lead Quad Flat Pack (QFP) Package for all of Holt’s ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.
Download PCN1103
MIL-STD-1553 Bus Transceivers Plastic SOIC Package Transfer v.1.0 1/20/2012
The purpose of this notification is to describe the changes to the 20 Pin Plastic Small Outline ESOIC-WB packages for the MIL-STD-1553 family of devices.
Download PCN1201
Addition of SPEL Semiconductor, India for QFN, TSSOP & SOIC Package Assembly v.1.0 1/20/2012
The purpose of this notification is to announce the addition of SPEL Semiconductor, India assembly facility for QFN, TSSOP and Small Outline (SOIC) packages for Holt’s ARINC 429, ARINC 825, MIL-STD 1553, and Discrete to Digital family of devices.
Download PCN1202
Addition of Millennium Microtech, Thailand for PLCC & SOIC Package Assembly v.1.0 1/20/2012
The purpose of this notification is to announce the addition of Millennium Microtech, Thailand assembly facility for Plastic Leaded Chip Carrier (PLCC) and Small Outline (SOIC) packages for Holt’s ARINC 429 and discrete to digital family of devices.
Download PCN1203
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