Package Reliability Report

To ensure that the highest possible product reliability standards are achieved and sustained, Holt Integrated Circuits maintains an active Product Reliability Monitoring Program. This program is designed to routinely monitor product reliability by package family and subcontractor assembly location. Package families monitored are SOIC, Thermal Enhanced SOIC, PLCC, QFN, TQFP and MQFP.


The downloadable Quarterly Device Reliability Report outlines stress tests performed, their duration, sample size and test method specifications. Any failures are fully analyzed and the failure mechanism identified to root cause. This information, along with all test results, is continuously used to drive product improvements.