Product Qualification Procedures

Holt Integrated Circuits product qualification procedures are designed to ensure that our products will not only conform to specification but will exceed our customers’ expectations.


To accomplish this, a comprehensive array of qualification tests is performed. These not only cover the electrical performance of the design but also the environmental and mechanical performance. Together these provide our customers with problem free ownership throughout the design, manufacturing, and product life cycles.


Electrical characterization is performed at all specified supply voltages and temperatures. Industrial range products are characterized at -40oC, 25oC, and +85oC. Extended temperature grade products (plastic and ceramic) are characterized at -55oC, 25oC, and +125oC.


Each new product is also subjected to environmental and mechanical tests to ensure that it can endure a customer’s assembly process and provides long-term reliability. Temperature Cycling (JED22-A104) and Highly-Accelerated Temperature and Humidity Stress Testing (JESD22-A110) are performed using samples that have been preconditioned to simulate maximum moisture absorption as well as the stresses of a typical industry multiple solder reflow process (JESD22-A113). Other environmental tests include High Temperature Operating Life (JESD22-A108) and High Temperature Storage (JESD22-A103).


All new die size and package combinations are tested for Moisture / Reflow Sensitivity (J-STD-020). Knowing the proper moisture sensitivity level (MSL) allows the customer to avoid any potential assembly problems (i.e. popcorning) by taking the proper precautions in advance. It is recommended that all customers read IPC/JEDEC J-STD 033 Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices and Holt application note AN-400 Surface Mount Plastic Packages for High Reliability Applications. As a service to our customers, all plastic surface mount devices above 20 leads are "baked out" and vacuum-sealed in a moisture barrier bag before shipment. Any device not rated as MSL level 1 will be labeled in accordance with IPC/JEDEC Standard J-STD-033.