Register
Log in
Feedback
Cart
0
Products
MIL-STD-1553
Transceivers
Encoder / Decoders
Integrated Terminals
Transformers
Protocol IP Core
Remote Terminal GUI
Drop-In Replacements
ARINC 429
Line Drivers
Protocol ICs with Parallel Interface
Line Receivers
Protocol ICs with SPI Interface
Data Management and Protocol Bridges
LCD Display Drivers
ARINC 825 (CAN)
Discrete-to-Digital
RS485 / 422
ARINC 717
Analog Switches
Ethernet
Downloads
Quality
Quality Systems
Certifications
Package Process Options
Issues & Returns
RMA Request Form
Package Reliability Report
Product Qualification Procedures
Quality App. Notes, Related Standards and PCNs
Sign Up for PCN Notifications
Company
Message from the President
Company Capabilities
News
Careers
Contact
Search:
Entire Site
Products
Documents
Content
Your file is downloading now...
Name
:
PCN1206
Title
:
Assembly Location Addition for Ceramic Side-Brazed DIP Package
Description
:
The purpose of this notice is to describe an addition to the location of assembly of ceramic packages for the ceramic side-brazed DIP package for both ARINC 429 and MIL-STD 1553 family of devices.
Would you like to be notified if revisions are made to this document?
(requires an account)