Product Quality Information Search Enter part number below Search Returns: Part Number Package Type Package Reliability Data Thermal Resistance Moisture Sensitivity Level Quality Quality Systems Certifications Package Process Options Ceramic Plastic Customer Problems and Return Material Authorization (RMA) Reliability Package Reliability Data Quartly Device Reliability Report / Procedures SOIC Thermal Enhanced SOIC TSSOP PLCC QFN TQFP MQFP Moisture Sensitivity Package Thermal Data Product Qualification Procedures Quality Application Notes, Related Standards and PCNs

Product Reliability Monitoring Program To ensure that the highest possible product reliability standards are achieved and sustained, Holt Integrated Circuits maintains an active Product Reliability Monitoring Program. This program is designed to routinely monitor product reliability by package family and subcontractor assembly location. Package families monitored are SOIC, Thermal Enhanced SOIC, PLCC, QFN, TQFP and MQFP. On line reports available (PDF): SOIC THERMAL ENHANCED SOIC (ESOIC) TSSOP PLCC QFN TQFP MQFP Stress tests performed, their duration, sample size and test method specifications are outlined in the downloadable Quarterly Device Reliability Report (PDF). Any failures are fully analyzed and the failure mechanism identified to root cause. This information, along with all test results, is continuously used to drive product improvements.

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