Product Quality Information Search Enter part number below Search Returns: Part Number Package Type Package Reliability Data Thermal Resistance Moisture Sensitivity Level Quality Quality Systems Certifications Package Process Options Ceramic Plastic Customer Problems and Return Material Authorization (RMA) Reliability Package Reliability Data Quartly Device Reliability Report / Procedures SOIC Thermal Enhanced SOIC TSSOP PLCC QFN TQFP MQFP Moisture Sensitivity Package Thermal Data Product Qualification Procedures Quality Application Notes, Related Standards and PCNs

Package Process Options Holt Integrated Circuits maintains a variety of standard package process options to meet our customers varied needs for both cost and reliability. For both Plastic and Ceramic packages, there are three standard process flows. The first is for Industrial Grade Products, designed for lower cost and an operating ambient of -40oC to +85oC. The second flow is for High Temperature Products (operating ambient of -55oC to +125oC). This flow includes 100% electrical test at each of the ambient temperature extremes. The last flow is for Military Grade Products. This flow is also designed for an operating ambient of -55oC to +125oC plus 100% electrical testing at each temperature extreme. In addition, the last flow also includes 100% "burn-in" to reduce infant mortality. If you have a special requirement for package processing, reliability screening or electrical performance, we can develop a custom process to meet your needs. The following downloadable tables detail our Standard Plastic and Ceramic Package Options: Ceramic Flow (PDF) Plastic Flow (PDF)

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