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Quality Application Notes, Related Standards and PCNs




Quality Application Notes, Related Standards and PCNs
AN-300 Lightning Protection Request
The Holt AN-300 Application Note provides a general overview of the effects of lightning on avionics systems in an aircraft along with the recommended protection measures. Included are lightning protection guidelines for Holt’s ARINC 429 line driver and receiver products. This application note is not available for download from this site. Please contact a Holt sales representative to receive a copy of this application note.

AN-400 Surface Mount Plastic Packages for High Reliability Applications
The AN-400 Application Note provides potential users of plastic encapsulated ICs with an overview of the available technology, guidelines for their use, and a summary of Holt’s rigorous qualification and screening procedures.

Holt RoHS Policy Lead-free / RoHS policy
In compliance with the RoHS European directives to eliminate lead in the electronics industry, Holt Integrated Circuits has adopted the use of 100% matte tin (Sn) plating for its RoHS compliant plastic packages. Package molding compounds have been upgraded so that the product is fully RoHS compliant and able to withstand the higher soldering temperatures of lead-free solder alloys. Tin whisker mitigation discussed.

JESD22-A103 High Temperature Storage Life
JEDEC test method used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices.

JESD22-A104 Temperature Cycling
JEDEC test method for determining the capability of solid state devices to withstand extreme temperature cycling.

JESD22-A108 Temperature, Bias, and Operating Life
JEDEC test method for determining the effects of bias conditions and temperature, over time, on solid state devices.

JESD22-A110 Highly-Accelerated Temperature and Humidity Stress Test (HAST)
JEDEC test method to evaluate the reliability of nonhermetic packaged solid state devices in humid environments.

JESD22-A113 Preconditioning of Plastic Surface Mount Devices Prior to Reliability Testing
Industry standard preconditioning flow for plastic SMDs (surface mount devices) that is representative of a typical industry multiple solder reflow operation.

JESD625-A Requirements for Handling Electrstatic-Discharge-Sensitive(ESDS) Devices
JEDEC standard that establishes the minimum requirements for Electrostatic Discharge (ESD) control methods and materials used to protect electronic devices that are susceptible to damage or degradation from electrostatic discharge (ESD).

J-STD-020 Moisture / Reflow Sensitivity Classification for Nonhermetic Solid State Surface
JEDEC standard for identifying the classification level of non-hermetic solid state Surface Mount Devices (SMDs) that are sensitive to moisture-induced stress.

J-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture / Reflow Sensitive
JEDEC standard that specifies the standardized levels of floor life exposure for moisture/reflow sensitive SMDs along with the handling, packing and shipping requirements necessary to avoid moisture/reflow-related failures.

PCN0801 HI-6110 Die Revision and Data Sheet Change
The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-6110 Product which will result in a change to its data sheet.

PCN0802 Marking and Data Sheet Change for HI-3585 Series of ARINC 429 SPI Interface Products
The purpose of this notification is to announce that Holt Integrated Circuits has standardized the naming and top side marking convention for the 3585 series of ARINC 429 SPI interface products and released the final production version of their respective data sheets.

PCN0803 44L TQFP (PTQS) Package Lead Formation
The purpose of this notification is to announce a change to the 44L TQFP (PTQS) package lead formation.

PCN0804 44L PLCC Package and DAP Size Standardization
The purpose of this notification is to announce that Holt Integrated Circuits has standardized the Die Attach Pad (DAP) size configuration for all products which previously used the 300 mil x 300 mil DAP 44L PLCC Package.

PCN0805 52-Lead Quad Flat Pack (QFP) Package Transfer
The purpose of this notice is to describe the changes to the 52-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.

PCN0806 Assembly Location and Mold Compound Change for QFN Packages
The purpose of this notice is to describe the changes to the QFN packages for the ARINC 429 and MIL-STD 1553 family of devices.



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