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Quality Application Notes, Related Standards and PCNs




Quality Application Notes, Related Standards and PCNs
AN-300 Lightning Protection Request
The Holt AN-300 Application Note provides a general overview of the effects of lightning on avionics systems in an aircraft along with the recommended protection measures. Included are lightning protection guidelines for Holt’s ARINC 429 line driver and receiver products. This application note is not available for download from this site. Please contact a Holt sales representative to receive a copy of this application note.

AN-400 Surface Mount Plastic Packages for High Reliability Applications
The AN-400 Application Note provides potential users of plastic encapsulated ICs with an overview of the available technology, guidelines for their use, and a summary of Holt’s rigorous qualification and screening procedures.

Holt RoHS Policy Lead-free / RoHS policy
In compliance with the RoHS European directives to eliminate lead in the electronics industry, Holt Integrated Circuits has adopted the use of 100% matte tin (Sn) plating for its RoHS compliant plastic packages. Package molding compounds have been upgraded so that the product is fully RoHS compliant and able to withstand the higher soldering temperatures of lead-free solder alloys. Tin whisker mitigation discussed.

JESD22-A103 High Temperature Storage Life
JEDEC test method used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices.

JESD22-A104 Temperature Cycling
JEDEC test method for determining the capability of solid state devices to withstand extreme temperature cycling.

JESD22-A108 Temperature, Bias, and Operating Life
JEDEC test method for determining the effects of bias conditions and temperature, over time, on solid state devices.

JESD22-A110 Highly-Accelerated Temperature and Humidity Stress Test (HAST)
JEDEC test method to evaluate the reliability of nonhermetic packaged solid state devices in humid environments.

JESD22-A113 Preconditioning of Plastic Surface Mount Devices Prior to Reliability Testing
Industry standard preconditioning flow for plastic SMDs (surface mount devices) that is representative of a typical industry multiple solder reflow operation.

JESD22-A114 Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)
This test method establishes a standard procedure for testing and classifying microcircuits according to their susceptibility to damage or degradation by exposure to a defined electrostatic Human Body Model (HBM) discharge (ESD). The objective is to provide reliable, repeatable HBM ESD test results so that accurate classifications can be performed.

JESD625-A Requirements for Handling Electrstatic-Discharge-Sensitive(ESDS) Devices
JEDEC standard that establishes the minimum requirements for Electrostatic Discharge (ESD) control methods and materials used to protect electronic devices that are susceptible to damage or degradation from electrostatic discharge (ESD).

J-STD-020 Moisture / Reflow Sensitivity Classification for Nonhermetic Solid State Surface
JEDEC standard for identifying the classification level of non-hermetic solid state Surface Mount Devices (SMDs) that are sensitive to moisture-induced stress.

J-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture / Reflow Sensitive
JEDEC standard that specifies the standardized levels of floor life exposure for moisture/reflow sensitive SMDs along with the handling, packing and shipping requirements necessary to avoid moisture/reflow-related failures.

PA-100 Product Advisory for HI-3585 and 3588
Description of the Recommended and Alternative methods for reading received data from the HI-3585 and HI-3588 over the SPI bus.

PCN0707 44-Pin Plastic QFP Assembly Location Change
The purpose of this notice is to describe the changes to the 44-pin plastic QFP packages for the HI-8448PQxx-xx family of ARINC 429 line receiver products.

PCN0801 HI-6110 Die Revision and Data Sheet Change
The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-6110 Product which will result in a change to its data sheet.

PCN0802 Marking and Data Sheet Change for HI-3585 Series of ARINC 429 SPI Interface Products
The purpose of this notification is to announce that Holt Integrated Circuits has standardized the naming and top side marking convention for the 3585 series of ARINC 429 SPI interface products and released the final production version of their respective data sheets.

PCN0803 44L TQFP (PTQS) Package Lead Formation
The purpose of this notification is to announce a change to the 44L TQFP (PTQS) package lead formation.

PCN0804 44L PLCC Package and DAP Size Standardization
The purpose of this notification is to announce that Holt Integrated Circuits has standardized the Die Attach Pad (DAP) size configuration for all products which previously used the 300 mil x 300 mil DAP 44L PLCC Package.

PCN0805 52-Lead Quad Flat Pack (QFP) Package Transfer
The purpose of this notice is to describe the changes to the 52-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.

PCN0806 Assembly Location and Mold Compound Change for QFN Packages
The purpose of this notice is to describe the changes to the QFN packages for the ARINC 429 and MIL-STD 1553 family of devices.

PCN0807 HI-6110 Die Revision and Data Sheet Change
The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-6110 Product which will result in a change to its data sheet.

PCN0808 3182PSx-N ARINC 429 Differential Line Driver Change for
The purpose of this notice is to describe the changes to the ARINC 429 Differential Line Driver Die Change for the 3182PSx-N.

PCN0809 32 & 64-Lead Quad Flat Pack (QFP) Package Transfer
The purpose of this notice is to describe the changes to the 32-Lead & 64-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, Discrete to Digital and LCD Display Driver family of devices.

PCN0810 Addition of Criteria Labs in Austin, Texas as a qualified ceramic package assembly supplier.
The purpose of this notice is to announce the addition of Criteria Labs in Austin, Texas as a qualified assembly supplier for ceramic side-brazed DIP package for both ARINC 429 and MIL-STD 1553 family of devices.

PCN0811 Wafer Fab Process Transfer for HI-8382/8383 & HI-8588/8588-10 Series of ARINC 429 Products
The purpose of this notice is to announce the completed transfer of the Holt devices manufactured using the 100mm 4.0um CMOS Wafer Process at Dalsa Semiconductor in Quebec, Canada to Dalsa’s 150mm 4.0um CMOS Wafer Process within the same fab.

PCN0812 Die Change for HI-3186PSx ARINC 429 Differential Line Driver
This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the HI-3186PSx.

PCN0901 Die Change for HI-3182PJx & HI-3183PJx ARINC 429 Differential Line Drivers
This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the HI-3182PJx and HI-3183PJx.

PCN0902 Die Change for HI-3188PSx ARINC 429 Differential Line Driver
This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the HI-3188PSx.

PCN0903 Die Change for HI-3182PSx & HI-3183PSx ARINC 429 Differential Line Drivers
This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the HI-3182PSx & HI-3183PSx.

PCN1001 HI-3585 & HI-3588 Data Sheet Change
The purpose of this notification is to announce that Holt Integrated Circuits has made a Datasheet change to the HI-3585 & HI-3588 Product which will result in the elimination of Product Advisory PA-100.

PCN1002 HI-3185PSx & HI-3185PSx-N ARINC 429 Line Driver Die Change
This notice describes the changes to the ARINC 429 Differential Line Driver Die for the HI-3185PSx & HI-3185PSx-N.

PCN1003 100-Lead Quad Flat Pack (QFP) Package Transfer
This notice describes the changes to the 100-Lead Quad Flat Pack (QFP) Package for the HI-8045PQx LCD Display Driver family of devices.

PCN1004 HI-3582A, HI-3583A & HI-3584A Data Sheet Change
The purpose of this notification is to announce that Holt Integrated Circuits has made a Datasheet change to the HI-3582A, HI-3583A, & HI-3584A Product.

PCN1005 MIL-STD-1553 Bus Transceivers Plastic SOIC Package Change
The purpose of this notification is to announce that Holt Integrated Circuits is making a change to the lead standoff for the 20 Pin Plastic Small Outline ESOIC-WB packages assembled at CEI, Thailand.



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